Vertiv™ CoolChip Fluid Network Rack Manifolds Empowering Efficient Data Center Liquid Cooling
Vertiv™ CoolChip Fluid Network Rack Manifolds provide a reliable, clean, and efficient path between servers and coolant distribution units (CDUs), playing a pivotal role in advanced data center liquid cooling solution. These stainless steel in-rack manifolds fit into the zero-U space of any industry-standard rack for easy installation, and come with drip-free quick connectors of various sizes to support flexible liquid cooling for data center deployments of all scales.
Multiple configurations meet diverse deployment needs, with efficient coupling methods, universal mounting brackets for quick installation, and vacuum-brazed stainless steel construction ensuring cleanliness—all to enhance your data center liquid cooling system performance.
Stainless steel ensures durability, with multiple sizes and flow rates available to meet custom liquid cooling solution demands. Drip-free quick connectors, air release valves, and integrated drain valves simplify installation and maintenance, while top/bottom connection options add flexibility for both rack level liquid cooling and row level liquid cooling. Vertiv also offers liquid cooling system OEM ODM services for tailored solutions.
Stainless steel pipes offer key advantages: corrosion resistance (ideal for harsh liquid cooling environments), smooth inner surfaces (boosting thermal efficiency), low maintenance, durability, coolant compatibility, and customizability.
Row-based manifolds enable efficient thermal management for next-generation data centers, especially in liquid cooling for AI GPU data center. As traditional air cooling struggles with dense, high-energy workloads (e.g., AI, hyperscale computing), liquid cooling has become a core solution, with row-based manifolds forming the backbone of a robust cooling system.
What is a row-based manifold?
A row-based manifold distributes coolant from a central CDU to server racks in a data center row, part of the Secondary Fluid Network (SFN) connecting CDUs to server cold plates—an integral part of liquid cooling infrastructure.
Figure 1. Row-based manifolds distribute coolant and form part of the Secondary Fluid Network (SFN), connecting the Coolant Distribution Unit (CDU) and cold plates inside servers.
Cold plates absorb chip heat, while row-based manifolds ensure efficient coolant delivery across racks, supporting DTC/RDHx applications and adapting to custom liquid cooling requirements.
Why are row-based manifolds needed?
- Scalability: Modular design adapts to diverse deployments, supporting cooling solution expansion.
- Reliability: 304L stainless steel and sanitary fittings protect cooling system integrity.
- Speed: Prefabricated components minimize downtime for row and rack level cooling.
- Customization: ETO configurations align with custom and OEM ODM needs.
The role of row-based manifolds in the entire liquid cooling system
Row-based manifolds sit between CDUs and in-rack manifolds, managing coolant flow across racks to maintain system stability—critical for row level cooling. CDUs (core of data center liquid cooling system) integrate seamlessly with row-based manifolds for scalable deployment. Perimeter cooling and heat rejection systems complement liquid cooling to ensure overall efficiency, supporting data center operations.
Figure 2. In a liquid cooling system, coolant circulates to directly remove heat from the plate surface, achieving efficient thermal management. Source: Vertiv
Figure 3. Row-based manifolds manage coolant flow between multiple racks, located between the Coolant Distribution Unit (CDU) and in-rack manifolds (top). Perimeter cooling and other heat rejection systems work together to remove residual heat and control humidity within the facility (bottom).
Intelligent control platforms with embedded sensors monitor manifolds in real time, enabling leak detection and predictive maintenance to protect cooling system investments.
Conclusion
Row-based manifolds are key to reliable, efficient liquid cooling for next-generation data centers. Integrated system design delivers long-term value, with manifolds supporting hyperscale to edge deployments.
EXTRCOOL is a reliable global specialist dedicated to liquid cooling solutions tailored for high-density AI and HPC data centers. We provide a full selection of premium thermal equipment including dual-mode CDUs, various manifold assemblies, cold plates, rear door heat exchangers, dry coolers and integrated container cooling units. Our well-designed solutions ensure stable running status, great universal adaptability and easy capacity expansion, facilitating one-stop full liquid cooling layout, and we offer professional services to data center businesses and corporate clients across Western Europe, Central Asia, South America, Southeast Asia and other major global markets.
