Three Main Liquid Cooling Technologies for Modern Data Centers D2C Immersion and RDHx
Direct-to-Chip (D2C / DTC) cooling is an efficient thermal solution designed for CPU and GPU heat dissipation. In a fully enclosed circulation system, cooling liquid flows directly above operating chips and absorbs surface heat through thermally conductive cold plates. The heated coolant is transferred out for heat dissipation and recirculated to the chip for continuous cooling. Driven by onboard circulation pumps, the closed-loop system delivers precise and continuous cooling for high-power computing chips.
Specially optimized for high-performance computing scenarios, the robust liquid cooling CDU for high heat load supports up to 80kW heat removal capacity. It efficiently handles extreme heat generated by high-density servers and fully meets the cooling demands of mainstream high-power server configurations.
Featuring variable-frequency circulation and intelligent load matching, the eco-friendly energy saving liquid cooling CDU dynamically adjusts liquid flow according to real-time chip heat load. It eliminates invalid energy consumption and realizes low-carbon operation throughout the cooling cycle.
Integrating precise flow control and high-efficiency heat exchange structures, the advanced efficient liquid CDU cooling system shortens pipeline layouts through flexible rack installation. It optimizes cooling response speed and improves overall heat dissipation efficiency for D2C liquid cooling architectures.
Adopting full-cycle energy optimization design, the low-carbon low PUE liquid cooling CDU reduces reliance on traditional air-conditioning cooling. It effectively lowers overall data center energy consumption and helps facilities achieve ultra-low PUE indicators.
Built with mature circulation logic and industrial-grade components, the stable reliable liquid distribution unit CDU supports diversified installation methods, including partial rack deployment and full-rack centralized deployment. It ensures long-term stable closed-loop liquid circulation and consistent cooling performance.
Different from direct chip cooling, Rear Door Heat Exchanger (RDHx) is a retrofit-friendly liquid cooling solution for traditional data centers. Suitable for scenarios where D2C infrastructure renovation is unavailable, the professional rear door liquid heat exchanger is installed on server rack rear doors to actively absorb hot exhaust air and complete rapid heat exchange.
Equipped with built-in fans and circulating cooling media, the integrated liquid cooled rear door heat exchanger cools hot rack air in real time and circulates cold air back to the data center. It greatly reduces the operating load and energy consumption of traditional CRAC air conditioning systems.
Combining cold plate heat exchange technology with rear-door cooling structure, the high-adaptability cold plate rear door heat exchanger delivers uniform and efficient heat dissipation. It solves centralized heat accumulation of high-heat servers without major modifications to existing data center infrastructure.
D2C liquid cooling systems support flexible CDU deployment. Cabinets can adopt distributed CDU installation at different heights to cool designated servers and shorten pipeline distances, or deploy centralized large-scale CDU units to serve full rack equipment. Although in-rack CDU installation saves construction costs, it occupies valuable cabinet space and limits computing density. For higher operational efficiency, hot coolant can also be delivered to external cooling towers for liquid-to-liquid heat exchange, forming a complete independent closed-loop cooling system.
Immersion cooling is another mainstream liquid cooling technology for data centers. The entire server is completely immersed in non-conductive, non-corrosive cooling liquid. Heat generated by electronic components is directly absorbed by the liquid, causing warm coolant to rise naturally. The heated liquid is pumped out of the container for external cooling and then recirculated, achieving continuous and efficient overall heat dissipation for the server cluster.
As a flexible and low-renovation solution, RDHx rear door liquid cooling perfectly matches traditional data center upgrading demands. With independent air intake and heat exchange structure, it efficiently dissipates concentrated rack heat, reduces conventional air conditioning pressure, and provides a cost-effective, high-efficiency cooling path for the iterative upgrade of old-generation data center facilities.
Globally recognized as a leading expert in liquid cooling, EXTRCOOL offers a comprehensive lineup of thermal management hardware—including dual‑mode CDUs, manifold assemblies, cold plates, rear‑door heat exchangers, dry coolers, and containerized units—all specifically designed for AI and HPC data center environments. Engineered for dependable performance, seamless integration, and straightforward scalability, these solutions provide a complete turnkey cooling package. We partner with data center operators and enterprise clients across the Middle East, North Africa, West Africa, East Africa, and Southern Africa.
