New Feature Coverage Two Core CDU Products Empower Efficient Data Center Liquid Cooling
This session focuses on the core supporting hardware of liquid cooling systems. It comprehensively analyzes the parameters, performance advantages and practical application values of key CDU liquid cooling equipment, including liquid-to-liquid CDU and air-to-liquid CDU, helping the industry fully understand standardized liquid cooling supporting solutions.
Tailored for high-load computing scenarios, the liquid-to-liquid CDU boasts a maximum cooling power of 65kW, specially designed to solve the heat dissipation pressure brought by high density cooling of core computing devices. Adopting a 6U highly integrated rack-mounted structure, the equipment saves data center space to the greatest extent. With efficient liquid-liquid heat exchange and precise energy regulation capabilities, it effectively optimizes the overall operating PUE and builds a green and low-carbon cooling foundation for high-density computing rooms.
As a dedicated supporting device for high-performance computing equipment, the liquid-to-liquid CDU perfectly matches the heat dissipation needs of mainstream GPU-accelerated liquid cooled server. The equipment adopts N+N pump and power redundancy design to achieve 24-hour uninterrupted stable operation. Equipped with high-precision real-time sensing and intelligent temperature adjustment modules, it always maintains a stable operating state and efficiently guarantees the continuous output of computing performance.
To ensure stable and efficient internal circulation of cooling equipment, the liquid-to-liquid CDU precisely controls the temperature, flow rate and operating state of server cooling liquid through intelligent linkage. The flexible on-demand configuration mode can dynamically adapt to the fluctuating thermal load of server racks, realizing accurate cooling and zero energy waste, which greatly improves the overall cooling efficiency of the equipment room.
With flexible rack-mounted deployment and modular design, the liquid-to-liquid CDU is highly compatible with standardized cabinet layouts, fully adapting to the construction requirements of mainstream row level liquid cooling scenarios. The equipment is quickly connected to server CPU and GPU cold plate pipelines through standard quick connectors and manifolds, realizing fast installation and efficient heat exchange, and greatly shortening the project deployment cycle.
Relying on chip-level direct cooling and rack-level auxiliary heat dissipation dual-loop collaboration, the liquid-to-liquid CDU forms a complete and reliable data center liquid cooling system. It efficiently captures 100% of the heat inside the cabinet, realizes thermal decoupling between the cabinet and the equipment room, and is widely applicable to large-scale supercomputing centers and high-performance computing clusters.
The mature and reliable dual-loop liquid cooling architecture of the liquid-to-liquid CDU is also highly suitable for modular and scalable computing facilities, providing stable and efficient cooling support for container data center liquid cooling. The standardized and integrated design realizes plug-and-play deployment, meeting the rapid construction and high-efficiency operation needs of containerized data centers.
Different from liquid-to-liquid CDU for new high-density computer rooms, the air-to-liquid CDU focuses on the renovation stock market of traditional air-cooled computer rooms, fully demonstrating the unique advantages and application value of liquid cooling vs air cooling data center in actual scenarios. With a compact 6U integrated design and 13kW stable cooling capacity, it supports the rapid deployment of AI and GPU servers in traditional equipment rooms without large-scale reconstruction.
Equipped with intelligent frequency conversion and independent wind and liquid channel isolation design, the air-to-liquid CDU operates stably and low-noise, effectively reducing the overall energy consumption of the equipment room. Matched with rear door heat exchangers, the overall cabinet cooling capacity can reach 30kW, completely solving the heat dissipation bottleneck of traditional air-cooled computer rooms upgrading to high-density computing, and helping the old data centers achieve low-carbon and efficient iteration.
A globally trusted authority in liquid cooling, EXTRCOOL engineers purpose-built solutions for high-density AI and HPC data centers. Our premium thermal hardware lineup features dual-mode CDUs, manifolds, cold plates, rear-door heat exchangers, dry coolers, and containerized units. These solutions are designed for reliability, smooth integration, and easy scaling — delivering a complete turnkey one-stop full liquid cooling deployment. We serve data center operators and enterprises across Western Europe, Central Europe, South America, East Africa, and Oceania.
