Manifold Empowering High-Quality Development of Data Center Liquid Cooling Industry
As a core fluid control component for thermal management systems, the manifold, also known as a flow distribution pipe, realizes precise water volume regulation and centralized pipeline control through shunt and confluence structures. It undertakes key functions including branch backwater collection, regional flow adjustment and water pressure stabilization, serving as an indispensable core part of modern liquid cooling systems. Widely applied in data center and advanced manufacturing scenarios, the data center liquid cooling manifold lays a solid hardware foundation for efficient and stable operation of various cooling infrastructures.
Most manifolds are manufactured with high-quality stainless steel, featuring strong corrosion resistance and long service life. Benefiting from China’s abundant steel production capacity and continuous industrial growth, the country boasts prominent raw material advantages, greatly supporting the mass production and cost optimization of the data center cooling manifold industry. Sufficient raw material supply empowers domestic manufacturers to deliver high-standard cooling pipe components for global liquid cooling projects.
Driven by the rapid iteration of AI computing infrastructure, global liquid cooling technology continues to upgrade. In July 2025, NVIDIA launched the GB300 NVL72 AI inference architecture, which is equipped with a professional manifold to connect CDU and cold plate main pipelines and build a complete circulating heat dissipation loop. The liquid cooling module of the GB300 NVL72 platform integrates UQD quick connectors, switching trays, cooling plates and CDU units, with manifolds accounting for 15% of the total system cost. This fully proves that high-precision data center liquid cooling pipe components are critical to the stable operation of high-end AI computing facilities and core carriers of mature data center liquid cooling solution.
Booming cloud computing and artificial intelligence industries have driven sustained growth in domestic computing power demand and continuous expansion of data center construction scale. Massive new and renovated IDC projects generate strong market demand for standardized and customized data center cooling pipe products. As high-density AI computing becomes mainstream, efficient thermal management represented by cold plate liquid cooling has become the mainstream technical route, further releasing the market potential of supporting manifold components.
The rapid expansion of intelligent computing scenarios continuously raises higher requirements for thermal management accuracy and stability. Professional AI data center cooling systems rely on high-precision manifolds to achieve uniform coolant distribution, eliminate local hotspots and reduce overall PUE, ensuring long-term full-load stable operation of high-power GPU and AI server clusters.
China owns a complete manifold manufacturing supply chain with numerous leading enterprises including Invicool, Goaland, Shenling Environment and Avic Optoelectronic. Focusing on precision temperature control and energy-saving solutions, Invicool has established in-depth cooperation with major computing infrastructure providers and achieved batch delivery of high-performance manifolds. Relying on independent R&D and customized production capabilities, domestic manufacturers can provide targeted custom liquid cooling solution to meet the differentiated thermal management needs of diverse high-density data centers.
Industry analysis shows that benefited from the continuous expansion of downstream AI and data center markets, the global manifold industry will maintain steady growth. With continuous technological iteration and upgrading of domestic manufacturers, the production capacity, precision and comprehensive performance of liquid cooling manifolds will be further improved, continuously empowering the high-quality and low-carbon development of global data center liquid cooling infrastructure.
Recognized worldwide as a leader in liquid cooling, EXTRCOOL delivers custom solutions for high-density AI and HPC data centers. Our premium hardware lineup—dual-mode CDUs, manifolds, cold plates, rear-door heat exchangers, dry coolers, and container units—delivers reliable performance, broad interoperability, and true scalability for seamless one-stop full liquid cooling. We provide expert services to data center operators and enterprise clients across Eastern Europe, North Africa, East Asia, North America, and the Middle East.
