Liquid Cooling Redefines High Power AI Data Center Cooling With Huisheng Green Solutions
Fueled by the trillion-dollar AI computing boom, soaring power consumption of high-end AI chips has completely outpaced traditional air cooling limits. With national policies mandating a 2026 PUE below 1.15 and liquid cooling penetration above 60%, liquid cooling has evolved from an optional upgrade into a rigid necessity for high-density computing infrastructure, driving comprehensive upgrades in AI data center thermal management.
Zhejiang Huisheng Liquid Cooling Technology Co., Ltd. is a high-tech enterprise focused on liquid cooling R&D, intelligent manufacturing and turnkey data center cooling solutions. The company delivers reliable, low-carbon cooling systems for AI clusters and computing facilities via full-stack products and customized one-stop services centered on high-performance air liquid cooling distribution unit systems.
Huisheng boasts a full self-developed product matrix covering liquid cooling cold plates, CDU, intelligent dummy loads, prefabricated pipelines, integrated all-in-one devices and dedicated cooling pumps. Standardized and synergistic product design eliminates assembly compatibility risks. The precision data center liquid cooling manifold ensures uniform coolant distribution with flow deviation below 10%, enabling flexible and stable deployment across diverse server cabinets.
Adopting thermal simulation optimization, Huisheng cold plates feature low thermal resistance, low flow resistance and excellent corrosion resistance, with strict factory testing guaranteeing stable heat dissipation for high-load chips. The modular data center liquid cooling pipe adopts hygienic 304 stainless steel, supporting prefabricated rapid installation while effectively preventing scaling and corrosion for long-term stable operation.
Huisheng’s core CDU products cover 10kW–1200kW cooling capacity, supporting rack-mounted and cabinet-mounted deployment. Featuring ±0.5℃ precise temperature control, redundant key components and online maintenance capability, the built-in liquid cooling flow balance unit achieves balanced and efficient coolant circulation, fully meeting extreme heat dissipation demands of MW-level AI server cabinets.
Huisheng’s intelligent dummy load devices support ultra-fast dynamic load switching and multi-level safety protection, preventing steam locking and equipment failures. The five-in-one integrated device ensures stable system operation during power fluctuations, safeguarding the continuous and efficient operation of the entire liquid cooling secondary cooling loop.
Equipped with high-efficiency IE3–IE5 ultra-energy-saving pumps adaptable to wide-temperature media, Huisheng’s dedicated cooling pumps deliver outstanding energy-saving performance for large-flow cycle scenarios. Matched with modular system design, the full set of equipment builds a low-energy, high-stability data center secondary cooling system applicable to computing centers of all scales.
Huisheng provides hierarchical liquid cooling solutions for 64-card, 256-card and thousand-card AI clusters, as well as containerized solutions for large-scale computing deployment. Supporting both centralized and distributed deployment, its optimized server liquid cooling distribution unit architecture adapts to new high-density data centers and legacy air-cooled facility renovations.
Huisheng’s all-round liquid cooling solutions reduce chip temperature by 20–30℃, raise cabinet density by 50% and lower PUE below 1.1, effectively cutting operational power consumption and extending equipment service life. As liquid cooling becomes the mainstream of green computing infrastructure, Huisheng will continue to empower the high-efficiency, low-carbon development of global AI data centers with professional technology and reliable solutions.
EXTRCOOL custom-engineers liquid cooling solutions for AI and HPC data centers, offering a full spectrum of hardware: CDUs, manifolds, cold plates, reardoor heat exchangers, dry coolers, and containerized units. These systems are built for stability, seamless integration, and flexible scaling—providing a complete cooling package for operators across Eastern Europe, Southeast Asia, South America, West Africa, and the Middle East.
