GreenCloud & Intel Joint Innovation in Data Center Liquid Cooling
Shenzhen GreenCloud Technology Co., Ltd. has recently made important moves in the data center liquid cooling field, including signing a strategic cooperation intent with global semiconductor giant Intel and launching related forum activities with liquid cooling technology as the core focus. The company’s operations director, who has an automation background and more than 20 years of internet experience, once held key positions at Wangsu Science & Technology and has achieved remarkable results in data center construction and management. With profound expertise in liquid cooling and data center technologies, he has edited several liquid cooling standards, holds multiple related patents, and is a member of the ODCC expert group.
Centering on low-carbon data center development, GreenCloud will host a speech themed Research on Application of Liquid Cooling Technology in Low-carbon Data Centers. The speech will focus on liquid cooling for data center in low-carbon scenarios, introduce the rapid growth of intelligent computing power and the importance of liquid cooling, and discuss policy-driven development trends and applications of rack level liquid cooling and row level liquid cooling. It will also analyze the advantages, categories and key elements of liquid cooling, compare immersion cooling vs cold plate cooling, share GreenCloud’s practical achievements in the liquid cooling field, explore data center liquid cooling renovation and the differences between liquid cooling vs air cooling data center, focus on liquid cooling high density computing, and call for industry-wide cooperation to promote the prosperity of the data center liquid cooling system ecosystem.
In conjunction with the forum, GreenCloud will open its Class A (T3+) data center computing industrial park for visits. Adopting an "air cooling + liquid cooling" architecture, the park provides high-quality computing services for industries such as intelligent driving, finance, government institutions and intelligent manufacturing. The visit route covers the air cooling solution computer room, trillion-scale large model data center, data center infrastructure and immersion liquid cooling data center. For those interested in participating in the forum, registration can be completed by scanning the QR code, and the organizer will contact registered participants to provide two-day conference lunch vouchers. Free factory visits are also available with prior confirmation from the organizer, though places are limited, and relevant contact information can be obtained for consultation.
A key highlight of GreenCloud’s recent moves is its strategic cooperation with Intel. The two parties have formally signed a cooperation intent to jointly develop an immersion cooling system based on Intel’s next-generation Birch Stream platform, tailored for green and low-carbon data centers. With the continuous surge in demand for high-performance computing, traditional air cooling can no longer meet the heat dissipation needs of high-density servers, making liquid cooling the ideal solution. The joint solution developed by GreenCloud and Intel features innovative TANK and CPU heat pipe designs, which can save 30% of energy compared to traditional air cooling and effectively reduce data center PUE.
As a leading data center liquid cooling system provider in China, GreenCloud holds nearly 100 technical patents, and its series of liquid cooling solutions have been widely applied in cloud computing, media convergence, video rendering, universities and other fields, with successful deployment in large supercomputing scenarios. The cooperation between GreenCloud and Intel integrates Intel’s leading advantages in the green data center field with GreenCloud’s R&D strength and rich practical experience in liquid cooling, aiming to break through heat dissipation bottlenecks, realize efficient server heat dissipation, and provide a solid computing base for the digital and intelligent transformation of various industries. Going forward, the two parties will steadily advance the R&D, manufacturing, testing and verification of immersion liquid cooling systems based on Intel’s high-performance computing products.
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