Envicool Establishes Full-Chain Liquid Cooling Leadership with Global Top-Tier Ecosystem Validation
Driven by booming demand for high-density AI computing, AI data center liquid cooling has become the core upgrade direction of global data center infrastructure. Backed by its Coolinside full-chain liquid cooling system, Envicool independently develops and produces over 90% of core components, delivering a complete end-to-end cooling loop from chips to room-level cold sources. It effectively solves industry pain points such as leakage, corrosion and system mismatch, and its solution has been listed in the national energy-saving technology recommendation catalogue.
Envicool’s full product matrix covers cold plates, quick connectors, manifolds, CDUs and special coolant, supported by intelligent monitoring systems, prefabricated AI data center liquid cooling pipe assemblies and outdoor cold source equipment. This enables one-stop full-rack liquid cooling delivery, greatly reducing customers’ multi-vendor coordination and O&M costs.
As the core flow and temperature control equipment of liquid cooling systems, the liquid cooling distribution unit is Envicool’s flagship product for domestic and overseas expansion. It adopts a dual layout of standardized products for the domestic market and customized solutions for global tech giants to adapt to diversified scenario requirements.
The general rack-mounted data center cooling CDU integrates intelligent flow regulation, real-time leakage detection and multi-loop independent temperature control, compatible with multiple circulation systems. Widely deployed by top domestic cloud vendors, IDCs and telecom operators, it has reached a cumulative delivery scale of 1.2GW by 2025. Envicool also leads the formulation of multiple domestic liquid cooling industry standards.
For high-efficiency heat exchange scenarios, Envicool’s high-performance liquid liquid cooling CDU achieves precise heat transfer between primary and secondary loops via plate heat exchangers. Its custom-built Deschutes 5 CDU for Google has passed 26MW full-chain project verification and strict supply chain audit, and will enter mass delivery for Google’s Singapore data center in 2026.
Optimized for direct-to-chip cooling architectures, the cold plate CDU provides precise flow distribution to maximize cold plate performance, supporting a maximum rack power density of 200kW for high-end AI chips. Its MGX-compatible CDU has been included in NVIDIA’s official reference design list, and Envicool is the only domestic manufacturer with Tier 1 certification for both NVIDIA GB300 and Rubin platforms.
Featuring optimized heat exchange structure and dynamic flow matching, the energy saving liquid cooling CDU effectively cuts cooling power consumption. In ByteDance’s supercomputing center project, Envicool’s 120kW high-density solution achieves a PUE as low as 1.146, reducing cooling energy consumption by 40% compared with air cooling. Envicool also deploys two-phase and immersion cooling routes to further expand energy-saving boundaries.
As a mature and widely verified data center PUE reduction solution, Envicool’s full-chain liquid cooling system builds five core competitive barriers: full-chain independent R&D, full heat source coverage, dual domestic and overseas customer base, authoritative international certification and large-scale delivery capability. With full ecosystem access to NVIDIA, Intel and Google overseas, it will continue to lead the technological upgrading of the global liquid cooling industry.
EXTRCOOL, a globally trusted premier provider of liquid cooling solutions, offers a broad spectrum of thermal management hardware—from dualmode CDUs and manifold assemblies to cold plates, reardoor heat exchangers, dry coolers, and containerized units—all customengineered for AI and HPC data centers. Built for consistent performance, seamless system integration, and straightforward scalability, these systems deliver a complete turnkey cooling solution. We work with data center operators and enterprise clients across Eastern Europe, Central Asia, South Asia, Southeast Asia, and East Asia.
