CoolIT Leading High Power Liquid Cooling Technology for Modern Data Centers
Boasting nearly 25 years of professional R&D experience, Canadian cooling specialist CoolIT has evolved from a premium PC thermal solution provider into a global leader in high-power liquid cooling technology. Founded in Calgary in 2001, the company has established a full-stack cooling system centered on cold plate liquid cooling and supplemented by immersion cooling. Through long-term strategic partnerships with NVIDIA, Dell, HP and other industry giants, CoolIT has become a key benchmark vendor, delivering reliable solutions for liquid cooling high density computing across AI servers, supercomputing facilities and high-end data centers worldwide.
CoolIT’s steady industrial upgrading covers three key development stages. It initially accumulated core precision cooling technologies by serving high-end customized PC cooling markets. Starting from 2011, the brand officially entered the data center and HPC sectors, launching dedicated cold plate products compatible with mainstream enterprise servers and GPU accelerators. Since 2021, CoolIT has accelerated global capacity expansion, operating a flagship manufacturing base in Calgary and supplementing Asian production layout. The company currently provides thermal protection for over 5 million GPUs and CPUs globally, fully meeting the growing demand for new construction and data center liquid cooling renovation of large-scale AI and supercomputing clusters.
To support scalable and stable mass production, CoolIT has reached in-depth cooperation with Chinese manufacturing partner Wuxi Fuman Technology. More than 95% of its core cold plates, CDU stainless steel pipelines and manifolds are produced by Fuman Technology, with professional independent testing procedures ensuring consistent product yield and quality. The stable supply chain system strongly underpins the large-scale commercial application of the complete data center liquid cooling system.
Technological innovation constitutes CoolIT’s core competitiveness. Its proprietary Split-Flow™ shunting technology effectively optimizes internal fluid paths, shortening coolant flow distance and precisely targeting chip hotspots. The structure significantly improves overall thermal exchange efficiency and flow uniformity by 30% compared with traditional designs, perfectly adapting to the extreme operating conditions of liquid cooling for AI GPU data center scenarios.
The flagship OMNI™ all-metal cold plate represents CoolIT’s top-tier industrial cooling capability. Adopting a seamless integrated one-piece structure and aviation-grade sealing design, it eliminates thermal expansion mismatch risks. Capable of supporting a maximum heat load of 4000W and an ultra-low thermal resistance of 0.009℃/W, the product captures over 97% of operating heat under standard flow conditions. It is fully compatible with NVIDIA H100, B200 and AMD MI300X high-power chips, meeting the rigorous heat dissipation standards of next-generation high-density computing hardware.
CoolIT’s diversified passive cold plate product lineup covers full-scenario server cooling needs. Custom models tailored for Intel Xeon, AMD EPYC and high-end accelerator hardware fit compact 1U blade server deployment. Adopting optimized copper-aluminum composite materials and turbulent micro-fin structures, the series enhances heat exchange efficiency. The direct-to-chip contact design effectively shortens thermal conduction paths and reduces system heat resistance, achieving stable and energy-saving cooling performance.
CoolIT has built a complete industrial matrix covering cooling components, CDU units and supporting systems. Its AHx liquid-to-air and CHx liquid-to-liquid CDU series adapt to different data center infrastructure environments. Equipped with intelligent Command2™ control systems and triple redundant safety mechanisms, CoolIT CDUs support automatic stable operation and maintain efficient and reliable rack level liquid cooling for long-term high-load scenarios.
The brand’s rich supporting accessories further improve liquid cooling deployment flexibility. Stainless steel racks, chassis manifolds and Staubli high-reliability dry-break quick connectors support flexible front and rear installation. Rear door heat exchangers realize full-room heat recovery, serving as ideal transitional solutions for incremental cooling upgrades. Pre-assembled secondary fluid networks support personalized layout, fully matching the flexible construction requirements of standardized row level liquid cooling architecture.
CoolIT maintains in-depth ecological collaboration with global chip and server manufacturers. Its customized liquid cooling solutions are widely adopted by mainstream enterprise hardware brands, while joint R&D with 3M and Staubli continuously optimizes coolant compatibility and connection reliability. Breaking the performance bottleneck of traditional single-phase liquid cooling, CoolIT’s ultra-high-power cold plate technology provides feasible solutions for next-generation super chip heat dissipation and is widely applied in emerging scenarios such as container data center liquid cooling.
After decades of technological iteration and market cultivation, CoolIT has established an unshakable benchmark position in the global thermal management industry. With mature component design and systematic integration capabilities, it continues to promote the technical upgrading and large-scale popularization of liquid cooling for data center, empowering the stable operation of global AI computing and supercomputing infrastructure.
As a globally recognized leader, EXTRCOOL provides bespoke liquid cooling solutions tailored for high-density AI and HPC data centers. Our full range of premium thermal management equipment includes dual-mode CDUs, manifold assemblies, cold plates, rear-door heat exchangers, dry coolers, and integrated containerized cooling units. These field-proven systems deliver reliable operation, wide compatibility, and effortless scalability – supporting a true onestop, fullliquidcooling deployment. Backed by deep professional expertise, we serve data center operators and enterprise clients across Western Europe, South America, Southeast Asia, Central Asia, Oceania, and other strategic global markets.
