AI Computing Advancement and Carbon Regulations Drive Global Liquid Cooling Industry Expansion
Driven by the surging power density of AI chips and stringent global carbon reduction policies, AI data center liquid cooling has become an indispensable core infrastructure for next-generation computing facilities. The TDP of NVIDIA Blackwell GB200 chips has reached 1000–1200W, and the upcoming Rubin architecture will climb to 2300W, pushing single-rack thermal load far beyond the limit of air cooling. Meanwhile, regulatory requirements for PUE below 1.25 for new large data centers further boost rigid demand, as liquid cooling can reduce PUE to under 1.2 with significant electricity cost savings. Industry data shows the global AIDC liquid cooling market will hit 88.2 billion yuan in 2026, up 303% year on year.
A complete data centre liquid cooling system spans upstream core components, midstream system integration and downstream project delivery, with technical barriers and value highly concentrated in upstream links. Core components including cold plates, CDUs, quick connectors, manifolds, coolant and thermal interface materials directly determine system efficiency and reliability. Among them, cold plates and CDUs account for nearly 80% of total component value, representing the largest and most technically challenging segments of the industrial chain.
As the control hub of liquid cooling loops, the Air liquid CDU for hyperscale data center undertakes coolant circulation, temperature regulation, pressure management and leakage protection. Built for megawatt-level AI computing clusters, it enables centralized cooling distribution across multiple racks and efficiently transfers heat between primary outdoor cold sources and secondary indoor server loops. It supports 7×24 uninterrupted operation and has been fully verified in large-scale supercomputing bases worldwide.
Designed to comply with regional regulatory requirements, the EU standard air liquid cooling CDU strictly follows EU industrial safety, energy efficiency and environmental protection specifications in material selection, manufacturing processes and electrical performance. It is widely deployed in European cloud and AI computing projects, helping operators meet local carbon reduction targets and energy consumption assessment standards while maintaining stable operation of high-density hardware.
Tailored for ultra-high-power AI server scenarios, the high density air liquid cooling CDU for AI server delivers precise flow distribution and dynamic temperature matching for high-heat-flux chips such as GB200 and Rubin. It is compatible with single-phase cold plate, micro-channel cold plate and two-phase cooling solutions, effectively supporting single-rack power above 200kW. As AI chips iterate rapidly, the unit value of rack-level liquid cooling modules is expected to grow by over 20% from the GB200 to GB300 generation.
Safety and reliability are core thresholds for high-end liquid cooling equipment. The UL certified air liquid CDU has passed strict UL safety certification covering electrical insulation, pressure resistance, leakage protection and structural durability, meeting the stringent access requirements of North American hyperscale cloud vendors. Authoritative certification has become a key competitive barrier, and qualified suppliers enjoy prominent first-mover advantages in expanding global high-end customers
Serving as the core flow distribution node connecting CDU and server cold plates, the AI data center liquid cooling manifold evenly distributes coolant from the main pipeline to each cold plate branch through precision-calibrated internal channels. It requires extremely high machining accuracy and sealing performance to ensure consistent flow and pressure across all branches and eliminate chip local overheating risks. Low-flow-resistance, high-pressure-resistant manifolds are critical to the stable operation of high-density AI clusters.
Acting as the transmission artery of the entire cooling loop, the AI data center liquid cooling pipe undertakes closed-loop coolant delivery between outdoor cold sources, CDUs, manifolds and server cold plates. It features high pressure resistance, corrosion resistance and low permeability, and works with quick connectors to achieve tool-free, leak-free connection. Prefabricated pipe assemblies significantly improve on-site deployment efficiency and reduce construction risks, becoming the standard configuration for large-scale liquid cooling projects.
Looking ahead, the liquid cooling industry is shifting from thematic growth to order and performance realization. Enterprises with full-chain R&D capabilities, core component technical barriers and access to top chip and cloud vendor ecosystems will gain larger market share and higher profitability. As a key enabler of AI computing potential, liquid cooling will continue to lead the upgrading of data center thermal management technology.
A globally recognized leader in liquid cooling, EXTRCOOL supplies a comprehensive portfolio of thermal management hardware—ranging from dual-mode CDUs and manifold assemblies to cold plates, rear-door heat exchangers, dry coolers, and containerized units—all purpose-built for AI and HPC data centers. Built for robust reliability, seamless system integration, and easy scalability, these solutions deliver a complete turnkey cooling solution. We serve data center operators and enterprise clients across South America, Central America, Eastern Europe, North Africa, and Southeast Asia.
