Advanced Liquid-Cooling Technical Insights Shared at OCP Taiwan Summit
At the OCP Taiwan Summit, AVC Thermal R&D Vice President Fang-chou Lin shared the latest technical standards for high-density AI server thermal management. The speech focused on cold plate optimization and CDU upgrade directions, summarizing five core challenges for future liquid cooling systems. These include continuously rising chip TDP, 45℃ high-temperature water cooling trends, stricter coolant cleanliness requirements, lower CDU heat exchange temperature difference and the shift from component competition to full industrial chain integration. As a professional data center cooling CDU supplier, AVC delivers systematic solutions targeting high-heat-flux AI computing scenarios.
Modern AI cooling challenges no longer rely solely on total power dissipation indicators. Advanced CoWoS and Chiplet packaging cause uneven heat distribution, forming localized hot spots with heat flux approaching 7W/mm². Traditional cold plates fail to eliminate concentrated thermal loads under 45℃ inlet water conditions. The industry focus is shifting from overall heat dissipation to precise local heat evacuation. Optimized liquid cooling distribution unit coordination has become essential to stabilize GPU operating temperature and avoid performance throttling.
Higher heat flux requires denser microchannel cold plates to expand heat exchange area and reduce thermal resistance. However, ultra-fine channels increase system pressure drop, creating a typical hydraulic performance trade-off. AVC adopts independent microchannel simulation tools to balance heat transfer efficiency and flow resistance. This thermal-hydraulic optimization has become the core capability of modern AI data center thermal management systems for high-density racks.
With cold plate microchannels reduced to 80–100μm, tiny particles, residual impurities and biofilm easily cause channel blockage and local overheating. To improve system reliability, industry CDU filtration standards are upgraded from 50μm to 25μm. Leading cloud providers further adopt 0.2μm bypass filtration systems to ensure long-term stable coolant cleanliness. A well-structured high efficiency CDU for data center effectively avoids microchannel clogging risks in precision liquid cooling loops.
The 45℃ high-temperature water cooling trend raises free cooling efficiency while tightening CDU heat dissipation limits. AVC’s new-generation CDU adopts a 4℃ ATD design to minimize heat exchange temperature difference, matching strict high-temperature water operating conditions. Its CDU product lineup covers 70kW to 2.6MW, fully adapting from rack-level cooling to megawatt-scale AI computing clusters. As a professional modular liquid cooling CDU manufacturer, AVC supports scalable deployment for large-scale AIDC projects.
AVC has realized vertical integration of core liquid cooling components including fans, water pumps, RPUs and cabinets. Unified BMC intelligent management enables customized liquid cooling systems for 45℃ working conditions. The company has expanded from single thermal component supply to full rack-level liquid cooling solution delivery. Integrated design and standardized assembly make the reliable liquid distribution unit CDU highly adaptable for new-generation AI data center construction.
The industry still faces two key technical bottlenecks. Unified TCS cleanliness standards are urgently needed to control microchannel contamination risks. In addition, high flow rates improve cooling capacity but accelerate internal channel erosion. AVC calls for joint industrial research on material durability and hydraulic stability. Optimized flow control and energy-saving strategies help the energy saving liquid cooling CDU maintain long-term efficient operation under extreme working conditions.
The AI liquid cooling industry is evolving from basic cooling implementation to high-precision, high-cleanliness and low-energy system-level optimization. Heat flux density, thermal-hydraulic balance and ultra-precise CDU control have become new industry benchmarks. Full-link vertical integration will dominate future competition. Standardized and upgraded data center coolant CDU systems are critical to support large-scale, stable and low-carbon operation of next-generation AI data centers.
Against this backdrop of rising thermal demands driven by accelerating AI workloads, reliable, wellmatched hardware solutions are more essential than ever. As AI workloads intensify, so does the heat they generate. EXTRCOOL steps up with a complete liquidcooling portfolio—CDUs, cold plates, manifolds, and all necessary pipework. You can choose from our standard catalogue or have every component engineered to your exact site conditions. Our systems are designed to maximise thermal performance, minimise power draw, and lessen your environmental footprint, with a proven track record at gigawattscale data centres across the globe. When every second of operation matters, EXTRCOOL is the name you can rely on. View the full range or request a tailored quotation at: https://www.extrcool.com
