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Liquid cooling has evolved from an optional upgrade to an indispensable foundation for modern kilowatt-scale AI computing, especially with NVIDIA Vera Rubin enforcing full fan-free liquid cooling standards. As high-power GPU racks push thermal limits far beyond air cooling capacity, professional data center air liquid cooling CDU solutions have become the mainstream retrofit and new-build choice for hyperscale facilities, delivering stable rack-level heat dissipation and flexible deployment compatibility.

As AI server cabinet power consumption surges 6–8 times higher than traditional racks, air cooling can no longer handle extreme thermal loads, making liquid cooling a mandatory infrastructure for high-density computing. Full-rack AI servers and liquid cooling are inherently paired, and NVIDIA’s widespread full-rack promotion has kickstarted industry adoption. Reliable CDU liquid cooling has become the standard thermal solution, driving liquid cooling from an optional upgrade to a default configuration for modern data centers.

Liquid cooling is gradually transforming from a mere auxiliary heat dissipation method into core AI infrastructure. Previously regarded as a supporting facility for chips, servers and data centers, it has now evolved into a complete thermal transportation system throughout the data center. As seen in NVIDIA GB200 NVL72 liquid-cooled racks that require 120kW cooling capacity, ultra-high power density makes thermal management a core factor determining chip operation, cabinet layout and data center delivery, where professional cold plate CDU serves as the core hardware supporting full-link stable heat dissipation.

Fueled by the explosive growth of AI large models, supercomputing and intelligent computing services, data centers are embracing a booming computing era, while confronting three major dilemmas: excessive power consumption, intensive heat generation and high energy costs. Traditional air-cooling solutions such as room air conditioners and cooling fans can no longer support high-density computing loads, suffering limited heat dissipation efficiency, massive energy waste, loud noise, dust accumulation and shortened device lifespan. In this context, liquid cooling has evolved from an optional upgrade to an industry necessity, reshaping the thermal management logic of modern green data centers with reliablecoolant distribution unit for liquid cooling core systems.

In April, Chinese authorities issued new policies to mandate efficient cooling adoption and tighten energy efficiency standards for new intelligent computing centers. On June 21, NVIDIA officially launched its Vera Rubin platform with a 100% full liquid cooling design, removing all cooling fans and replacing traditional rubber hoses with rigid metal manifolds. As policy constraints and chip industry standards upgrade, liquid cooling has shifted from an optional feature to a must-have foundation for AI computing expansion. Surging single-rack power density has rendered air cooling obsolete. A complete data center liquid cooling system forms the full thermal circulation chain from chips, cold plates and pipelines to CDU heat exchange, pump-valve circulation, chiller heat dissipation and real-time sensor monitoring, with technical barriers growing closer to core chips.

In spring 2025, NVIDIA’s global audit team visited Envicool in Shenzhen Longhua. After evaluating dozens of vendors worldwide, the team recognized Envicool’s mature engineering strength rather than radical innovation. Its UQD quick connectors and MQD manifolds were later included in NVIDIA MGX ecosystem, marking its leading position among Chinese liquidcooling enterprises. As a proven solution provider, Envicool supplies highperformance server rack air liquid CDU for highdensity AI compute racks.

On June 21, 2026, NVIDIA launched its Vera Rubin 100% liquidcooling solution. It raises coolant temperature to 45°C for fullloop fanfree operation. Adopting large coldplate and microchannel technologies, it cuts data center PUE from 1.35 to 1.15 with nearzero cooling water consumption. The compact air liquid CDU unit delivers stable fluid control to match this highpower AI thermal architecture.

As large-language AI models keep evolving, data centers are undergoing fundamental underlying-architecture transformation. At TechWeek Shanghai forum Liquid Cooling 2.0 Waste Heat Monetization and Computing-Node Collaborative Innovation, Xu Zhiyu, architect from UCloud, delivered a systematic sharing on liquid-cooling adoption and real-world practices in data centers. He deeply analyzed how liquid cooling turns into a critical capability for AI-era computing infrastructure, covering industry trends, technical paths and large-scale deployment experience. The low noise air liquid CDU helps deliver quiet thermal operation for these next-generation facilities.

The cold-chain logistics industry faces high energy consumption, substantial electricity costs and strict temperature-control requirements. Dual demands for cost-effective energy conservation and product quality assurance have become increasingly urgent. Jiangxi Zero-Carbon Future developed the customized Bingnengbao low-temperature phase-change cold storage unit to break traditional cold-room energy-consumption bottlenecks and deliver well-fitted solutions for cold-chain enterprises and EMC service providers. The advanced cold room refrigeration unit brings new energy-saving possibilities to cold-chain facilities.

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