Full Liquid
Cooling Solution
This is the optimal hybrid full liquid cooling solution for data centers. It adopts "chip-level + cabinet-level" hierarchical heat dissipation to capture 100% of cabinet heat, realizing thermal decoupling between the cabinet and the data center. The CDU directly cools CPU/GPU hotspots, removing 70-80% of core heat; while the RDHx rear door captures 20-30% of residual heat from memory and hard drives. Dual loops collaborate to enable full liquid cooling.
System Components
Complete full liquid cooling infrastructure for AI data centers
Liquid & Liquid CDU
- Rack Integration: Designed for direct installation within server racks to achieve compact, close-proximity cooling.
- Localized Heat Dissipation: Efficiently manages coolant distribution and heat exchange for single or a few cabinets, targeting local hotspots.
- Flexible Expansion: Modular design allows flexible deployment and scaling to meet demand, suitable for high thermal density areas.
Manifold
- Connects CDUs to server cold plates, distributes low-temperature coolant, and collects high-temperature coolant.
- Balances flow to prevent local overheating and supports hot-swapping to reduce maintenance costs.
- Adapts to liquid cooling needs of multiple power architectures, helping optimize cabinet PUE and improving heat dissipation reliability.
Liquid-Cooled Rear Door
- Active Heat Dissipation: Equipped with fans or pumps, forcing airflow through the heat exchanger to more efficiently remove server heat.
- High-Density Efficiency: Handles ultra-high-density cabinets, delivering exceptional cooling performance while maintaining stable data center temperature.
- Precise Control: Adjusts fan or pump speed based on load for finer cooling management and energy savings.
Water Pump
- Drives power for the entire full liquid cooling system, circulating the coolant.
- Works with water manifolds to regulate flow, ensuring uniform heat dissipation for end equipment.
- Collaborates with the water tank to supplement pressure and vent air, maintaining system stability.
Water Tank
- Stores sufficient coolant to balance liquid volume across multiple rear doors.
- Absorbs flow fluctuations caused by simultaneous water demand from multiple cabinets, ensuring stable coolant supply to each cabinet.
- Balances system pressure to prevent sudden pressure drops caused by insufficient chiller supply.
Dry Cooler
- Cools the hot water discharged from servers through air convection, dissipating heat to the outdoors to complete heat exchange.
- Requires no water consumption, suitable for water-scarce areas, and avoids water consumption and scale issues associated with traditional cooling towers.
- Stabilizes the temperature of the primary-side coolant, supplying low-temperature liquid for subsequent cycles to ensure system heat dissipation efficiency.
Refrigeration Module
- Precise Temperature Control: Liquid cooling chillers precisely control water temperature and flow to ensure equipment temperature remains within the optimal range at all times.
- Energy Saving & Consumption Reduction: The liquid cooling system reduces significant power consumption required for air cooling, delivering higher cooling efficiency compared to traditional cooling methods.
- High-Density Deployment: As high-density AI applications expand, traditional air cooling solutions fail to meet heat dissipation demands. High-efficiency chillers support efficient heat exchange.
CDU Deployment & Heat Dissipation
Liquid-to-Liquid CDU system principle and full liquid cooling circulation flow
Deployment & Connection
Designed as a 6U rack-mount unit, the CDU installs side-by-side with servers. It connects to the supply/return liquid ports of CPU/GPU cold plates via quick-connect fittings and short-distance pipelines.
Heat Dissipation Process
High-heat components in servers transfer heat to the secondary-side coolant (Ethylene Glycol/Propylene Glycol) through cold plates. The hot coolant flows into the CDU via the Manifold, where heat is exchanged with the primary-side chilled water through the heat exchanger. The cooled coolant is then pressurized by the CDU circulation pump and returned to servers via the Manifold, achieving continuous heat dissipation.
Dual-Loop Collaborative Full Liquid Cooling
Chip-level high-efficiency heat dissipation combined with cabinet-level residual heat capture
Loop 1 CDU (D2C): High-temperature loop directly cooling CPU/GPU — Loop 2 RDHx: Low-temperature loop capturing residual heat via rear door
- Liquid-to-liquid CDU: Via D2C (Direct-to-Chip liquid cooling), precisely and efficiently removes extreme heat from core components such as CPUs/GPUs (accounting for 70-80% of total power consumption).
- RDHx Liquid-Cooled Rear Door: Captures all remaining "residual heat" discharged by servers that is not covered by D2C (accounting for 20-30% of total power consumption).
- The two work in synergy to ensure that 100% of the heat generated by the cabinet is fully absorbed and carried away by liquid, so that the air discharged from the cabinet is at the same temperature as the data center room.
